Integrated semiconductor die parceling platforms

ABSTRACT

In certain embodiments, a system includes: an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects; a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station is configured to add a desiccant to the die vessel; a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle; and a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority to U.S. Provisional PatentApplication No. 62/751,350, filed on Oct. 26, 2018, which isincorporated by reference herein in its entirety.

BACKGROUND

Modern manufacturing processes are highly automated to manipulatematerials and devices and create a finished product. However, qualitycontrol, packaging, and maintenance processes often rely on human skill,knowledge and expertise for processing and inspection of themanufactured product both during manufacture and as a finished product.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that various features are not necessarily drawn to scale. In fact,the dimensions and geometries of the various features may be arbitrarilyincreased or reduced for clarity of discussion.

FIG. 1 is a flowchart of an integrated semiconductor die parcelingprocess, in accordance with some embodiments.

FIG. 2A is a block diagram of an integrated semiconductor die parcelingplatform, in accordance with some embodiments.

FIG. 2B is a plan view illustration of the integrated semiconductor dieparceling platform, in accordance with some embodiments.

FIG. 2C is a perspective view illustration of the integratedsemiconductor die parceling platform, in accordance with someembodiments.

FIG. 3 is a schematic diagram of a die vessel, in accordance with someembodiments.

FIG. 4A is a flowchart of an inspection process, in accordance with someembodiments.

FIG. 4B illustrates an image sensor of an inspection station positionedover a die vessel, in accordance with some embodiments.

FIG. 5 is a flowchart of an inspection process, in accordance with someembodiments.

FIG. 6A is a side view illustration of how a bag may be lifted from atop of a bag stack, in accordance with some embodiments.

FIG. 6B is a side view illustration of how the bag may be lifted fromthe top of the bag stack, in accordance with some embodiments.

FIG. 6C is a side view illustration of how the bag may be separated fromthe bag stack, in accordance with some embodiments.

FIG. 6D is a side view illustration of how the bag may be opened, inaccordance with some embodiments.

FIG. 6E is a plan view illustration of the suction tube positionsrelative to the bag, in accordance with some embodiments.

FIG. 6F is a side view illustration of how the bag may be opened usingthe tongue bar, in accordance with some embodiments.

FIG. 6G is a front view illustration of how the bag may be fully opened,in accordance with some embodiments.

FIG. 6H is a side view illustration of how the die bundles may beinserted in the bag, in accordance with some embodiments.

FIG. 6I is a front view illustration of how the bag may be closed, inaccordance with some embodiments.

FIG. 6J is a front view illustration of how the bag may be sealed, inaccordance with some embodiments.

FIG. 7 is a cross sectional illustration of a suction conduit made ofmultiple individual constituent tubes, in accordance with someembodiments.

FIG. 8 is a block diagram of various functional modules of an integratedsemiconductor die parceling platform functional module, in accordancewith some embodiments.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

The following disclosure describes various exemplary embodiments forimplementing different features of the subject matter. Specific examplesof components and arrangements are described below to simplify thepresent disclosure. These are, of course, merely examples and are notintended to be limiting. For example, it will be understood that when anelement is referred to as being “connected to” or “coupled to” anotherelement, it may be directly connected to or coupled to the otherelement, or one or more intervening elements may be present.

In addition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Systems and methods in accordance with various embodiments are directedto an integrated semiconductor die parceling platform. Semiconductor dieparceling may refer to final, or near final, packaging of asemiconductor die for delivery to a purchaser or owner of the endsemiconductor die product. The semiconductor dies may be singulated diesor chips from a semiconductor wafer. The semiconductor dies may bebrought to the integrated semiconductor die parceling platform in theform of a die vessel. The die vessel may be a tray, a boat, or any typeof container for the transport of semiconductor dies. The die vessel maybe brought to a load port station of the semiconductor die parcelingplatform. An inspection station of the semiconductor die parcelingplatform may be configured to receive the die vessel from the load portstation. The inspection station may be configured to inspect the dievessel for defects related to a number of die and die quality (e.g., aquality of the die within the die vessel). A desiccant station of thesemiconductor die parceling platform may be configured to receive thedie vessel from the inspection station. The desiccant station may beconfigured to add a desiccant to the die vessel. A bundle station of thesemiconductor die parceling platform may be configured to receive thedie vessel from the desiccant station. The bundle station may beconfigured to combine the die vessel with another die vessel as a diebundle. A bagging station of the semiconductor die parceling platformmay be may be configured to receive the die bundle from the bundlestation. The bagging station may be configured to dispose the die bundlein a die bag, create a vacuum within the die bag; and heat seal the diebag with the die bundle in a vacuum environment. In certain embodiments,the bagging station may also be configured to print a bar code on thedie bag, before, during, or after deposit of the die bundle in the diebag. A folding station of the semiconductor die parceling platform maybe may be configured to receive the die bag from the barcode station.The folding station may be configured to fold the die bag into anoutport car. The outport car may be moved from the integratedsemiconductor die parceling platform. For simplicity of discussion, theterm die container may reference an object in which dies may betransported, and may reference a die vessel, a die bundle and/or a diebag.

The integrated semiconductor die parceling platform may provide anintegrated platform where each station is connected with another in anautomated fashion. Each station may be a stationary point or locationfor processing a die container, from the initial load port station tothe final folding station. Accordingly, die containers (e.g., dievessels) need only be brought to a load port station of the integratedsemiconductor die parceling platform to be processed. Then, the dievessels may be inspected, bundled, bagged, labeled, and then placed inan outport car for transport from the integrated semiconductor dieparceling platform, all without manual or human intervention by anoperator of the integrated semiconductor die parceling platform.

In various embodiments, each station of the integrated semiconductor dieparceling platform may be interconnected via a conveyor system. Theconveyor system may describe the automated interconnections between thestations to bring the die containers (e.g., die vessels, die bundles,and/or die bags) from one station to another. In certain embodiments,the conveyor system may include a system of robotic arms and conveyorbelts configured to receive the die vessels at one station and to movethe die vessels for receipt (e.g., processing) at another station.

The die vessel may be made of any type of material suitable forsemiconductor die transport, such as a plastic or a metal. In certainembodiments, the die vessel may be referred to as a tray or a boat.Also, in particular embodiments, the die vessel may include a number ofconcave receptacles (e.g., pockets) in which individual dies may beplaced (e.g., housed). These dies may be, optionally, further adhered inplace in virtue of rotatable pin that may contact a top surface of a diewhile the die rests with a bottom surface on the die vessel.

FIG. 1 is a flowchart of an integrated semiconductor die parcelingprocess, in accordance with some embodiments. The integratedsemiconductor die parceling process may be performed by an integratedsemiconductor die parceling platform. It is noted that the process 100is merely an example, and is not intended to limit the presentdisclosure. Accordingly, it is understood that additional operations maybe provided before, during, and after the process 100 of FIG. 1, certainoperations may be omitted, certain operations may be performedconcurrently with other operations, and that some other operations mayonly be briefly described herein.

At operation 102, a die vessel may be brought to a load port station.The load port station may be a point of entry for the integratedsemiconductor die parceling platform. This point of entry may beconfigured to interface with, for example, an automated materialhandling system or by manual handling (e.g., deposit) of the die vesselto the load port station. As noted above, the die vessel may includemultiple semiconductor dies that are arranged on the die vessel.Accordingly, depositing the die vessel in the load port station may alsodeposit the constituent semiconductor dies that are in (e.g., restingon) the die vessel. Further discussion of die vessels will be providedbelow. In certain embodiments, the load port station may have multipleload port shelves (e.g., be configured to receive more than one dievessel at a time). For example, the integrated semiconductor dieparceling platform may have two or three load port shelves so as toreceive two or three die vessels at a same time.

In various embodiments the load port station may be interfaced with aconveyor system of the integrated semiconductor die parceling platform.The conveyor system may be an automated system for moving die containers(e.g., die vessels, die boats, and die bags) within the integratedsemiconductor die parceling platform between stations. For example, theconveyor system may include various conveyor belts and robotic arms.These conveyor belts may be disposed between stations and the roboticarms may, as necessary, move the die containers to and from the conveyorbelt and stations.

At operation 104, the die vessel may enter a buffer station. The bufferstation may be a temporary repository of die vessels. In variousembodiments, the buffer station may include a number of shelves on whichdifferent die vessels may be placed, with each separated vertically fromthe other. The die vessels may be taken to the buffer station and fromthe buffer station via the conveyor system of the integratedsemiconductor die parceling platform.

At operation 106, the die vessel may enter an inspection station. Theconveyor system may bring the die vessel from the buffer station to theinspection station. The inspection station may be configured to inspectthe die vessels for defects. These defects may be defects of the dievessel itself and/or the constituent semiconductor dies. For example,the inspection station may be configured to inspect the die vessel for adefects, such as lack of an expected number of semiconductor dies on thedie vessel. The inspection station may also be configured to inspect thesemiconductor dies on the die vessels, such as to detect whether thesemiconductor dies are of a correct size and/or if they have anunexpected surface feature or non-uniformity. In various embodiments,the inspection station may include an image sensor configured to captureimage data of semiconductor dies on a die vessel at known (e.g.,predetermined or expected) locations on the die vessel. This image datamay be analyzed to determine whether there is a defect. A remediationstep may be performed if there is a defect, such as by moving thedefective die vessel associated with the defect (e.g., defect at the dievessel or at an individual semiconductor die) to a particular area ofthe integrated semiconductor die parceling platform for remediationand/or stopping the processing of the defective die vessel on theintegrated semiconductor die parceling platform. Alternatively, theconveyor may move the die vessel from the inspection station should nodefect be detected.

At operation 108, the die vessel may enter a desiccant station. Theconveyor system may move the die vessel to the desiccant station fromthe inspection station. The desiccant station may include a mechanism toadd a desiccant to the die vessel. The desiccant may be a hygroscopicsubstance that induces or sustains a state of dryness in its vicinity,such as a solid that absorbs water. This mechanism may be, for example,a robotic arm or an overhead depositor that may deposit the desiccant onthe die vessel. In certain embodiments, each die vessel may receive adesiccant. However, in other embodiments, only one die vessel within adie bundle may receive a desiccant. Accordingly, only certain dievessels (e.g., not all die vessels) may receive a desiccant.

At operation 110, the die vessel may enter a bundle station. Theconveyor system may move the die vessel from the desiccant station tothe bundle station. At the bundle station, the die vessel may be bundledwith other die vessels as a die bundle. This die bundle may include apredetermined number of die vessels stacked on top of the other and thensecured together via a harness. The harness may be moved over thestacked die vessels and then tightened over the stacked die vessels toadhere the die vessels together. In certain embodiments, a robotic armsystem of one or more robotic arms or other manipulators at the bundlestation may take individual die vessels, stack them on each other, andthen secure them together using the harness. Then, the die bundle,including multiple die vessels, may be moved via the conveyor system toanother station. In certain embodiments, the harness may have a bundlingtension (e.g., string tension) of about 15 to about 20 kilograms and awidth of about 12 millimeters or greater.

At operation 112, the die bundle may enter a bagging station. Theconveyor system may move the die bundle from the bundle station to thebagging station. The bagging station may be configured to place the diebundle into a container, such as a bag or a box. For example, thebagging station may be configured to place the die bundle into a bag. Incertain embodiments, the bag may be substantially made of aluminum. Thebagging station may have access to a bag stack of bags, from which abagging station manipulator system may be configured to remove and opena single one of the bags for deposit of the die bundle. After die bundledeposit, the bagging station may be configured to remove the gas in thebag via a suction conduit to create a vacuum environment. In certainembodiments, this suction conduit may be made of multiple constituenttubes, adhered together, that make up the suction conduit. In certainembodiments, the suction force at each of the multiple constituentsuction tubes may be around 30 pounds per square inch (PSI). Then, oncethe gas is removed and a vacuum environment is created in the bag, thebagging station may be configured to seal the bag. The bag may be sealedby application of heat to melt some of the bag material to create aseal. For example, the bag may be made of aluminum, such that heat maybe applied to part of the aluminum to melt the aluminum and seal thebag. In certain embodiments, the heat applied may be from about 80 toabout 250 degrees centigrade and the width of the seal may be greaterthan 10 millimeters. For ease of explanation, a die bag may also referto the entirely of a bag with a die bundle inside. In certainembodiments, the bagging station may include a barcode printerconfigured to label bags either before, during, or after the die bundlesare inserted within the bags. These labels may be a barcode labelindicating information associated with the die bag. For example, theselabels may characterize the dies within the die bag.

At operation 116, the die bag may enter a folding station. The conveyorsystem may bring the die bag from the bagging station to the foldingstation. The folding station may be configured to fold the die bag andmove the die bag into an outport car. The outport car may include anumber of shelves on which different die bags may be placed, with eachseparated vertically from the other. Each die bag may be folded at thefolding station so that the bag may fit within a respective shelf of theoutport car. The folding and deposit of the die bags onto the outportcar may be performed by an outport car processing manipulator systemwhich may include at least one robotic arm configured to take a die bagfrom the conveyor and to place the die bag onto a respective shelf ofthe out port car. In certain embodiments, the outport car processingmanipulator system may also be configured to fold each die bag so as toreduce the size of the die bag and so that the die bag may fit within ashelf of the outport car. For example, the outport car processingmanipulator system may be configured to fold the die bag to tuck excessmaterial on the die bag against a solid surface of the die bag (invirtue of the die bundle within the die bag). Then, this folded die bagmay be deposited onto a shelf of the outport car. In certainembodiments, the folding station may fold the die bags but the conveyorsystem may place the die bags on the outport car.

At operation 118, the outport car may move die bags away from theintegrated semiconductor die parceling platform. In addition to havingshelves to store die bags, the outport car may include wheels in whichthe outport car may be wheeled (e.g., pushed or pulled) away from thesemiconductor die parceling platform.

FIG. 2A is a block diagram of an integrated semiconductor die parcelingplatform 200, in accordance with some embodiments. The integratedsemiconductor die parceling platform 200 may include multiple stations202-216 that are connected via a conveyor system 220. The conveyorsystem 220 may describe the automated interconnections between thestations 202-216 to bring the die vessels to and/or from the stations202-216. In certain embodiments, the conveyor system may convey dievessels via conveyor belts and robotic arms configured to receive thedie vessels at one station and to move the die vessels for receipt(e.g., processing) at another station. The conveyor belt may representany physical apparatus configured for substantially lateral motion, suchas a conveyor belt with rollers and pulleys that may transport dievessels across a top surface of the conveyor belt. For example, theconveyor system 220 may connect, in order, a load port station 202, abuffer station 204, an inspection station 206, a desiccant station 208,a bundle station 210, a bagging station 212, and a folding station 216.Each station may be a stationary point or location for processing asemiconductor die vessel in the course of being processed by theintegrated semiconductor die parceling platform, from the initial loadport station 202 to the final folding station 216.

Accordingly, the integrated semiconductor die parceling platform mayprovide an integrated platform where each station is connected withanother in an automated fashion. A die vessel need only be brought to aload port station of the integrated semiconductor die parceling platformto be processed. Then, the die vessels may be inspected, bundled,bagged, labeled, and then placed in an outport car for transport fromthe integrated semiconductor die parceling platform, all without manualor human intervention by an operator of the integrated semiconductor dieparceling platform.

FIG. 2B is a plan view illustration of the integrated semiconductor dieparceling platform 200, in accordance with some embodiments. As notedabove, the integrated semiconductor die parceling platform may have theload port station 202, the buffer station 204, the inspection station206, the desiccant station 208, the bundle station 210, the baggingstation 212, the labeling station 214 and the folding station 216.

The conveyor system 220 may be configured to move die packages betweenthe load port station 202, the buffer station 204, the inspectionstation 206, the desiccant station 208, the bundle station 210, thebagging station 212, the labeling station 214 and the folding station216. The conveyor system may include conveyor belts configured to movedie containers (e.g., die vessels, die bundles, and/or die bags) in asubstantially lateral motion to and from stations. To facilitate themovement via the conveyor belts, robotic arms (not illustrated) may belocated next to the conveyor belts to move die containers to and fromthe conveyor belt and a nearby station.

The load port station 202 may include one or more load port shelves 222,such as three load port shelves 222 in the illustrated embodiment. Also,the buffer station 204 may have multiple buffer shelves 224, such asfive buffer shelves 224. The conveyor system may include a firstconveyor belt 220A to bring the die vessels from the load port station202 to the buffer station 204. The conveyor system may also include oneor more robotic arms, in addition to the first conveyor belt 220A, tomove the die vessels to and from the first conveyor belt 220A and theload port station 202 and/or the buffer station 204.

The inspection station 206 may include a sensor arranged over a part ofa second conveyor belt 220B of the conveyor system 220. The secondconveyor belt 220B may move die vessels from the buffer station 204, tothe desiccant station 208, and then to the bundle station 210. Theinspection station is illustrated to a side of the second conveyor belt220B for ease of illustration, but may be disposed above the secondconveyor belt 220B in certain embodiments. The conveyor system 220 mayinclude the second conveyor belt 220B and one or more robotic arms (notillustrated) to move die vessels to and from the second conveyor belt220B.

The desiccant station 208 may include multiple desiccant loaders 208A,which may place a desiccant on a die vessel, such as a die vessel beingtransported by the conveyor belt 220A. In certain embodiments, thesecond conveyor belt 220B may be configured to move die vessels into thebundle station 210 to form die bundles. For ease of illustration in thisplan view, the first conveyor belt 220A is illustrated as separated fromthe bundle station 210 but may be connected to the bundle station 210 incertain embodiments so that die vessels may enter the bundle station210. In other embodiments, the second conveyor belt 220B may not enterthe bundle station 210 so that a robotic arm may move die vessels fromthe second conveyor belt 220B to the bundle station 210.

Die bundles may be transported from the bundle station via a thirdconveyor belt 220C of the conveyor system 220. This third conveyor belt220C may move the die bundles from the bundle station 210 to the baggingstation 212. In certain embodiments, at least one robotic arm may movedie bundles between the bundle station 210 and the third conveyor belt220C and/or between the third conveyor belt 220C and the bagging station212.

The bagging station 212 may bag the die bundles to produce a die bagfrom each die bundle. As noted above, the bagging station may also bagthe die bundles so that the die bundles are in a vacuum environment thatis heat sealed. In certain embodiments, the bagging station 212 may alsolabel the bags either before, during, or after the bags receive theirrespective die bundles. In various embodiments, the bagging station maystore bags at a bag storage area 232, then label the bags using abarcode printer 230 before depositing die bundles within bags to formdie bags.

The die bags may exit the bagging station 212 and be transported to thefolding station 216 via a fourth conveyor belt 220D of the conveyorsystem 220. In certain embodiments, at least one robotic arm may movedie bundles between the bagging station 212 and the fourth conveyor belt220D and/or between the fourth conveyor belt 220D and the foldingstation 216.

The folding station may fold the die bag in a manner that may beinserted within an outport car. In certain embodiments, the foldingstation may interface with a fifth conveyor belt 220E that may take afolded die bag and place the folded die bag within an outport car 240.Thus, the conveyor system may include one or more robotic arms, inaddition to the fifth conveyor belt 220E, to move die vessels to andfrom the fifth conveyor belt 220E. In other embodiments, the foldingstation may directly place the folded die bag into the outport car 240,such as via a robotic arm of the folding station.

FIG. 2C is a perspective view illustration of the integratedsemiconductor die parceling platform 200, in accordance with someembodiments. As noted above, the integrated semiconductor die parcelingplatform may have the load port station 202, the buffer station 204, theinspection station 206, the desiccant station 208, the bundle station210, the bagging station 212, and the folding station 216.

The load port station 202, the buffer station 204, and the outport car240 may include shelves 250 from which die containers (e.g., a dievessel or a die bag) may be secured and/or guided along during insertionor removal from a respective load port station 202, buffer station 204,or outport car 240. When inserted, the die vessels may be located at aset predetermined vertical distance from each other, as determined bythe shelves 250. In addition to having shelves to store die bags, theoutport car 240 may include wheels 252 in which the outport car 240 maybe wheeled away from the semiconductor die parceling platform 200.

FIG. 3 is a schematic diagram of a die vessel 302, in accordance withsome embodiments. The die vessel 302 may include a number of receptacles304 in which to a die may be placed. For example, there may be eightreceptacles 304, as illustrated in the embodiment of FIG. 3. Each of thereceptacles may be substantially rectangular in shape with a furtherprotrusion along the square corner portions 306 of a respectivereceptacle 304. Optionally, each of the square corner portions 306 maybe adjacent to pin holes in which a pin 308A, 308B may be disposed. Thepins 308A, 308B may be configured (e.g., rotated) to be disposed over adie when the die is to be transported using the die vessel 302 and to beremoved from over the die when the die is not to be transported usingthe die vessel. For example, pins 308A (drawn in phantom) illustrate howthe pins 308A is disposed over a die 309 (drawn in phantom) when the dieis to be transported using the die vessel 302. Also, pins 308B (drawn inphantom) illustrate how the pins 308B are not disposed over a die 309when the die 309 is not to be transported using the die vessel 302(e.g., to be removed from the die vessel).

FIG. 4A is a flowchart of an inspection process 400, in accordance withsome embodiments. The inspection process 400 may be performed by anintegrated semiconductor die parceling platform. It is noted that theprocess 400 is merely an example, and is not intended to limit thepresent disclosure. Accordingly, it is understood that additionaloperations may be provided before, during, and after the process 400 ofFIG. 4, certain operations may be omitted, certain operations may beperformed concurrently with other operations, and that some otheroperations may only be briefly described herein.

At operation 402, the inspection station of the integrated semiconductordie parceling platform may position an image sensor over a die vessel.In certain embodiments, the image sensor may be positioned by remainingstationary while a die vessel is brought within the image sensor's fieldof view. Accordingly, the conveyor system of the integratedsemiconductor die parceling platform may move the die vessel within theimage sensor's field of view in order for the image sensor to bepositioned over the die vessel.

At operation 404, the inspection station may be configured to inspectthe die vessels for defects. This inspection may include collectingimage data using the image sensor and analyzing the image data fordefects. In various embodiments, the inspection station may include animage sensor configured to capture image data of semiconductor dies on adie vessel at known (e.g., predetermined or expected) locations on thedie vessel. This image data may be analyzed to determine whether thereis a defect. These defects may be defects of the die vessel itselfand/or the constituent semiconductor dies. For example, the inspectionstation may be configured to inspect the die vessel for a defects, suchas lack of an expected number of semiconductor dies on the die vessel.The inspection station may also be configured to inspect thesemiconductor dies on the die vessels, such as to detect whether thesemiconductor dies are of a correct size and/or if they have anunexpected surface feature or non-uniformity.

At operation 406, a decision may be made as to whether there is a defectbased on the inspection at operation 404. If there is a defect, theprocess 400 may proceed to operation 408. If no defect is detected, theprocess may proceed to operation 410.

At operation 408, a remediation step may be performed to remediate forthe defect. This remediation step may include, for example, removing thedie vessel with the defect from the integrated semiconductor dieparceling platform. In other embodiments, this remediation may includemoving the defective die vessel associated with the defect (e.g., defectat the die vessel or at an individual semiconductor die) to aremediation location for remediation and/or not further processing thedefective die vessel.

At operation 410, the conveyor system may move the die vessel from theinspection station to another station should no defect be detected. Forexample, the conveyor system may move the die vessel to a desiccantstation should no defect be detected.

FIG. 4B illustrates an image sensor 450 of an inspection stationpositioned over a die vessel 452, in accordance with some embodiments.The image sensor 450 may remain stationary while the die vessel 452 isbrought within the image sensor's field of view while moving along aconveyor belt 454 (e.g., the second conveyor belt, discussed above) ofan integrated semiconductor die parceling platform's conveyor system.Accordingly, the conveyor system of the integrated semiconductor dieparceling platform may move the die vessel 452 within the image sensor'sfield of view in order for the image sensor 450 to be positioned overthe die vessel to collect image data of the die vessel 452.

FIG. 5 is a flowchart of an inspection process, in accordance with someembodiments. The inspection process may be performed by a integratedsemiconductor die parceling platform. It is noted that the process 500is merely an example, and is not intended to limit the presentdisclosure. Accordingly, it is understood that additional operations maybe provided before, during, and after the process 500 of FIG. 5, certainoperations may be omitted, certain operations may be performedconcurrently with other operations, and that some other operations mayonly be briefly described herein.

In some embodiments, the operations or blocks of the process 500 may beassociated with various illustrated features as shown in FIGS. 6A, 6B,6C, 6D, 6E, 6F, 6G, 6H, 6I, and 6J respectively, which will be discussedin further detail below. Referring now to FIG. 5, the process 500 startswith operation 502, where a bag may be lifted from a top of a bag stack.The process 500 continues to operation 504, where the bag may beseparated from the bag stack. The process 500 continues to operation506, where the bag may be opened via suction forces. The processcontinues to operation 508, where the bag may be opened via a tonguebar. The process 500 continues to operation 510, where the bag may befully opened. The process 500 continues to operation 512, where diebundles may be inserted in the bag. The process 500 continues tooperation 514, where the bag may be closed. The process 500 continues tooperation 516, where the bag may be heat sealed.

FIG. 6A is a side view illustration of how a bag may be lifted from atop of a bag stack, corresponding to operation 502 of FIG. 5, inaccordance with some embodiments. The bag stack 602 may include multiplebags stacked one on top of another. A bag 604 on the top of the bagstack 602 may undergo a suction force via suction tubes 606. Morespecifically, respective suction openings 608 of the suction tubes 606may touch a portion of the bag proximate with a bag opening. A guide barmay be disposed above the bag to control the portion of the bag 604lifted by the suction produced by the suction openings 608. The bag maybe lifted via moving the suction tubes in an upward motion away from thebag stack 602. In certain embodiments, the suction force at each of thesuction tubes may be around 30 pounds per square inch (PSI).

FIG. 6B is a side view illustration of how the bag 604 may be liftedfrom the top of the bag stack, corresponding to operation 502 of FIG. 5,in accordance with some embodiments. The plan view includes multiplesuction locations 612 for the suction openings to contact the bag 604.In certain embodiments, a clamp 614 may secure an end of the bag 604 andmoved to assist the lifting of the bag by the suction openings 608.

FIG. 6C is a side view illustration of how the bag 604 may be separatedfrom the bag stack 602, corresponding to operation 504 of FIG. 5, inaccordance with some embodiments. As noted above, the clamp 614 maysecure an end of the bag 604. The clamp 614 may secure the bag 604 by apincer motion that pinches a top surface and a lower surface of the bag604. Also, as the clamp 614 lifts the bag in an upward motion, a tonguebar 618 may be slipped under the bag 604 to separate the bag 604 fromother bags in the bag stack 602. In certain embodiments, the tongue barmay be about 10 millimeters in thickness to present a sufficiently slimprofile for bag separation.

FIG. 6D is a side view illustration of how the bag 604 may be opened,corresponding to operation 506 of FIG. 5, in accordance with someembodiments. Top suction tubes may be arranged around four top suctiontube positions 620, 622, 624, 626 so as to contact the bag 604 from atop side. Also, bottom suction tubes may be arranged also around fourbottom suction tube positions 630, 632, 634, 636 so as to contact thebag 604 from a bottom side. Each of the suction tube positions 620, 622,624, 626, 630, 632, 634, 636 may also represent a respective suctionopening position that faces the bag. Two of the top suction tubepositions 620, 622 may be closer to a first opening end 638A of the bag604. Another two of the top suction tube positions 624, 626 may becloser to a second end 638B of the bag opposite the first opening end ofthe bag 604. Likewise, the bottom suction tube position 630 may becloser to the first opening end of the bag 604 than the other threesuction tube positions 632, 634, 636. Also, the suction tube positions620 and 630 may be aligned along a first horizontal axis 640A (e.g., anX axis). The top suction tube positions 624 626 may be offset along thefirst horizontal axis 640A from the bottom suction tube positions 632,634, and 636.

FIG. 6E is a plan view illustration of the suction tube positionsrelative to the bag 604, corresponding to operation 506 of FIG. 5, inaccordance with some embodiments. The top suction tube positions 620Aand 620B may correspond to the suction tube position 620 along the firsthorizontal axis 640A. However, the top suction tube positions 620A and620B may be displaced from each other closer to opposite ends of the bag604 along a second horizontal axis 640B. Also, the top suction tubepositions 622A and 622B may correspond to the suction tube position 622along the first horizontal axis 640A. However, the suction tubepositions 622A and 622B may be displaced from each other closer toopposite ends of the bag 604 along the second horizontal axis 640B.Also, the top suction tube positions 624A and 624B may correspond to thesuction tube position 624 along the first horizontal axis 640A. However,the suction tube positions 624A and 624B may be displaced from eachother closer to opposite ends of the bag 604 along the second horizontalaxis 640B. Also, the top suction tube positions 626A and 626B maycorrespond to the suction tube position 624 along the first horizontalaxis 640A. However, the suction tube positions 626A and 626B may bedisplaced from each other closer to opposite ends of the bag 604 alongthe second horizontal axis 640B.

Similarly, the bottom suction tube position 632A and 632B may correspondto the suction tube position 632 along the first horizontal axis 640A.However, the suction tube positions 632A and 632B may be displaced fromeach other closer to opposite ends of the bag 604 along the secondhorizontal axis 640B. Also, the bottom suction tube position 634A and634B may correspond to the suction tube position 634 along the firsthorizontal axis 640A. However, the suction tube positions 634A and 634Bmay be displaced from each other closer to opposite ends of the bag 604along the second horizontal axis 640B. Also, the bottom suction tubeposition 636A and 636B may correspond to the suction tube position 636along the first horizontal axis 640A. However, the suction tubepositions 636A and 636B may be displaced from each other closer toopposite ends of the bag 604 along the second horizontal axis 640B.Lastly, the bottom suction tube position 630 may be equidistant from thetop suction tube positions 620A and 620B along the second horizontalaxis 640B. In certain embodiments, the suction force at each of thesuction tubes may be around 30 pounds per square inch (PSI).

FIG. 6F is a side view illustration of how the bag 604 may be openedusing the tongue bar 618, corresponding to operation 508 of FIG. 5, inaccordance with some embodiments. As the bag 604 is opened (e.g., as theopening 642 is revealed as the bag is opened), the tongue bar 618 may beinserted into the opening to further open the bag 604.

FIG. 6G is a front view illustration of how the bag 604 may be fullyopened, corresponding to operation 510 of FIG. 5, in accordance withsome embodiments. The horizontal aspect of the front view may be alongthe second horizontal axis 640B. Opening clamps 644A, 644B may grasponto a top portion 604A of the bag 604 and opening bars 646A, 646B maybe against a bottom portion 604B of the bag 604. More specifically, thebag 604 may be fully opened when the opening clamps 644A, 644B, whilegrasping onto the top portion 604A of the bag 604 is at a maximumdistance away from the opening bars 646A, 646B against the bottomportion 604B of the bag 604.

FIG. 6H is a side view illustration of how the die bundles 650 may beinserted in the bag 604, corresponding to operation 512 of FIG. 5, inaccordance with some embodiments. As noted above, the die bundle 650 maybe a collection of die vessels stacked on each other and bundledtogether with a harness. The die bundle may be inserted into the bag 604via the opening 642 of the bag.

FIG. 6I is a front view illustration of how the bag 604 may be closed,corresponding to operation 514 of FIG. 5, in accordance with someembodiments. As noted above, opening clamps 644A, 644B may grasp onto atop portion 604A of the bag 604 and the opening bars 646A, 646B may beagainst a bottom portion 604B of the bag 604. The bag 604 may be closedby moving the opening clamps 644A, 644B, while grasping onto the topportion 604A of the bag 604, toward the opening bars 646A, 646B againstthe bottom portion 604B of the bag 604. Also, suction conduits 656 maybe configured to suction the gas out of the bag 604 while the openingclamps 644A, 644B are moved toward the opening bars 646A, 646B. Thesuction conduits may be located toward a side of the bag 604 between theopening clamps 644A, 644B and the opening bar 646A, 646B.

FIG. 6J is a front view illustration of how the bag 604 may be sealed,corresponding to operation 516 of FIG. 5, in accordance with someembodiments. The closed bag, with the clamps 614 and tongue bar 618removed, may be heat sealed by applying heat 660 from one end of the bagto the other end of the bag along the second horizontal axis 640B fromboth a top and bottom of the bag 604. In certain embodiments, the bagmay be made of a metal, such as aluminum, which may melt and seal thebag. In particular embodiments, an impulse sealer may be utilized toperform heat sealing of the bag 604. In certain embodiments, the heatapplied may heat the bag from about 80 to about 250 degrees centigradeand the width of the seal may be greater than 10 millimeters.

FIG. 7 is a cross sectional illustration of a suction conduit 656 madeof multiple individual constituent tubes 656A, 656B, 656C, 656D, 656E,in accordance with some embodiments. The suction conduit 656 may be madeof a number of constituent tubes, such as five tubes, in certainembodiments. Each of the constituent tubes 656A, 656B, 656C, 656D, 656Emay be collected within an outer casing 670. These multiple constituenttubes 656A, 656B, 656C, 656D, 656E may make the application of vacuumforce more even at an end of the suction conduit than if the suctionconduit included only a single opening.

FIG. 8 is a block diagram of various functional modules of an integratedsemiconductor die parceling platform functional module 802, inaccordance with some embodiments. The integrated semiconductor dieparceling platform functional module 802 may be part of an integratedsemiconductor die parceling platform. The integrated semiconductor dieparceling platform functional module 802 may include a processor 804. Infurther embodiments, the processor 804 may be implemented as one or moreprocessors.

The processor 804 may be operatively connected to a computer readablestorage module 806 (e.g., a memory and/or data store), a networkconnection module 808, a user interface module 810, and a controllermodule 812. In some embodiments, the computer readable storage module806 may include logic that may configure the processor 804 to performthe various processes discussed herein. The computer readable storagemay also store data, such as sensor data collected by an image sensor ofan inspection station, image data for identifying a defect, identifiersfor a die, identifiers for a die vessel, identifiers for a diecontainer, identifiers for an image sensor, and any other parameter orinformation that may be utilized to perform the various processesdiscussed herein.

The network connection module 808 may facilitate a network connection ofthe integrated semiconductor die parceling platform with various devicesand/or components of the workstation that may communicate within orexternal to the integrated semiconductor die parceling platformfunctional module 802. In certain embodiments, the network connectionmodule 808 may facilitate a physical connection, such as a line or abus. In other embodiments, the network connection module 808 mayfacilitate a wireless connection, such as over a wireless local areanetwork (WLAN) by using a transmitter, receiver, and/or transceiver. Forexample, the network connection module 808 may facilitate a wireless orwired connection with various parts of the integrated semiconductor dieparceling platform.

The integrated semiconductor die parceling platform functional module802 may also include the user interface module 810. The user interfacemodule 810 may include any type of interface for input and/or output toan operator of the integrated semiconductor die parceling platform,including, but not limited to, a monitor, a laptop computer, a tablet,or a mobile device, etc.

The integrated semiconductor die parceling platform functional module802 may include a controller module 812. In certain embodiments, thecontroller module 812 may be implemented by (e.g., be part of) theprocessor 804. The controller module 812 may be configured to controlvarious physical apparatuses that control movement or functionality ofthe integrated semiconductor die parceling platform, such as theconveyor system. For example, the controller module 412 may beconfigured to control movement or functionality for at least one of aconveyor belt, robotic arm, and the like. For example, the controllermodule 412 may control a motor that may move at least one of a conveyorbelt and/or a robotic arm. The controller module 412 may be controlledby the processor 804 and may carry out the various aspects of thevarious processes discussed herein.

In certain embodiments, a system includes: an inspection stationconfigured to receive a die vessel, wherein the inspection station isconfigured to inspect the die vessel for defects; a desiccant stationconfigured to receive the die vessel from the inspection station,wherein the desiccant station is configured to add a desiccant to thedie vessel; a bundle station configured to receive the die vessel fromthe desiccant station, wherein the bundle station is configured tocombine the die vessel with another die vessel as a die bundle; and abagging station configured to receive the die bundle from the bundlestation, wherein the bagging station is configured to dispose the diebundle in a die bag and to heat seal the die bag with the die bundleinside.

In certain embodiments, a system includes: an inspection stationconfigured to receive a die vessel, wherein the inspection station isconfigured to inspect the die vessel for defects; a bundle stationconfigured to receive the die vessel from the inspection station,wherein the bundle station is configured to combine the die vessel withanother die vessel as a die bundle; a bagging station configured toreceive the die bundle from the bundle station, wherein the baggingstation is configured to: dispose the die bundle in a die bag; create avacuum within the die bag; and heat seal the die bag with the die bundlein a vacuum environment inside; and a folding station configured toreceive the die bag from the bagging station, wherein the foldingstation configured to fold the die bag into an outport car.

In certain embodiments, a method includes: receiving a die vessel at aninspection station, wherein the inspection station is configured toinspect the die vessel for defects; receiving the die vessel, from theinspection station, at a bundle station, wherein the bundle station isconfigured to combine the die vessel with another die vessel as a diebundle; and receiving the die bundle, from the bundle station, at abagging station, wherein the bagging station is configured to disposethe die bundle in a die bag and to heat seal the die bag with the diebundle inside.

The foregoing outlines features of several embodiments so that thoseordinary skilled in the art may better understand the aspects of thepresent disclosure. Those skilled in the art should appreciate that theymay readily use the present disclosure as a basis for designing ormodifying other processes and structures for carrying out the samepurposes and/or achieving the same advantages of the embodimentsintroduced herein. Those skilled in the art should also realize thatsuch equivalent constructions do not depart from the spirit and scope ofthe present disclosure, and that they may make various changes,substitutions, and alterations herein without departing from the spiritand scope of the present disclosure.

In this document, the term “module” as used herein, refers to software,firmware, hardware, and any combination of these elements for performingthe associated functions described herein. Additionally, for purpose ofdiscussion, the various modules are described as discrete modules;however, as would be apparent to one of ordinary skill in the art, twoor more modules may be combined to form a single module that performsthe associated functions according embodiments of the invention.

A person of ordinary skill in the art would further appreciate that anyof the various illustrative logical blocks, modules, processors, means,circuits, methods and functions described in connection with the aspectsdisclosed herein can be implemented by electronic hardware (e.g., adigital implementation, an analog implementation, or a combination ofthe two), firmware, various forms of program or design codeincorporating instructions (which can be referred to herein, forconvenience, as “software” or a “software module), or any combination ofthese techniques. To clearly illustrate this interchangeability ofhardware, firmware and software, various illustrative components,blocks, modules, circuits, and steps have been described above generallyin terms of their functionality. Whether such functionality isimplemented as hardware, firmware or software, or a combination of thesetechniques, depends upon the particular application and designconstraints imposed on the overall system. Skilled artisans canimplement the described functionality in various ways for eachparticular application, but such implementation decisions do not cause adeparture from the scope of the present disclosure.

Furthermore, a person of ordinary skill in the art would understand thatvarious illustrative logical blocks, modules, devices, components andcircuits described herein can be implemented within or performed by anintegrated circuit (IC) that can include a general purpose processor, adigital signal processor (DSP), an application specific integratedcircuit (ASIC), a field programmable gate array (FPGA) or otherprogrammable logic device, or any combination thereof. The logicalblocks, modules, and circuits can further include antennas and/ortransceivers to communicate with various components within the networkor within the device. A general purpose processor can be amicroprocessor, but in the alternative, the processor can be anyconventional processor, controller, or state machine. A processor canalso be implemented as a combination of computing devices, e.g., acombination of a DSP and a microprocessor, a plurality ofmicroprocessors, one or more microprocessors in conjunction with a DSPcore, or any other suitable configuration to perform the functionsdescribed herein.

Conditional language such as, among others, “can,” “could,” “might” or“may,” unless specifically stated otherwise, are otherwise understoodwithin the context as used in general to convey that certain embodimentsinclude, while other embodiments do not include, certain features,elements and/or steps. Thus, such conditional language is not generallyintended to imply that features, elements and/or steps are in any wayrequired for one or more embodiments or that one or more embodimentsnecessarily include logic for deciding, with or without user input orprompting, whether these features, elements and/or steps are included orare to be performed in any particular embodiment.

Additionally, persons of skill in the art would be enabled to configurefunctional entities to perform the operations described herein afterreading the present disclosure. The term “configured” as used hereinwith respect to a specified operation or function refers to a system,device, component, circuit, structure, machine, etc. that is physicallyor virtually constructed, programmed and/or arranged to perform thespecified operation or function.

Disjunctive language such as the phrase “at least one of X, Y, or Z,”unless specifically stated otherwise, is otherwise understood with thecontext as used in general to present that an item, term, etc., may beeither X, Y, or Z, or any combination thereof (e.g., X, Y, and/or Z).Thus, such disjunctive language is not generally intended to, and shouldnot, imply that certain embodiments require at least one of X, at leastone of Y, or at least one of Z to each be present.

It should be emphasized that many variations and modifications may bemade to the above-described embodiments, the elements of which are to beunderstood as being among other acceptable examples. All suchmodifications and variations are intended to be included herein withinthe scope of this disclosure and protected by the following claims.

What is claimed is:
 1. A system, comprising: an inspection stationconfigured to receive a die vessel, wherein the inspection station isconfigured to inspect the die vessel for defects utilizing an imagesensor arranged over part of a conveyor system; a desiccant stationconfigured to receive the die vessel from the inspection station,wherein the desiccant station comprises at least one desiccant loaderthat is configured to add a desiccant to the die vessel; a bundlestation configured to receive the die vessel from the desiccant station,wherein the bundle station comprises a plurality of die vessels stackedon top of one another and configured to be secured together via aharness; a bagging station configured to receive the die bundle from thebundle station, wherein the bagging station is configured to dispose thedie bundle in a die bag and to heat seal the die bag with the die bundleinside, wherein the bagging station comprises a suction conduitconfigured to remove a gas from the die bag; and a folding stationconfigured to receive the die bag from the bagging station, wherein thefolding station comprises a robotic arm configured to fold the die bagand deposit the folded die bag onto one of a plurality of shelves of anoutport car, wherein the outport car transports the folded die bag fromthe system.
 2. The system of claim 1, wherein the inspection station,the desiccant station, the bundle station, and the bagging station areconnected via the conveyor system that moves the die vessel in anautomated manner.
 3. The system of claim 2, wherein the conveyor systemcomprises a conveyor belt.
 4. The system of claim 1, wherein the baggingstation is configured to print a bar code on the die bag.
 5. The systemof claim 1, wherein the outport car comprises wheels and is configuredto be wheeled from the folding station.
 6. The system of claim 1,further comprising: a buffer station configured to store die vesselsreceived at a load port on buffer shelves, wherein the inspectionstation is configured to receive the die vessel from the buffer station.7. The system of claim 1, wherein the inspection station is configuredto inspect the die vessel for a number of die and die quality.
 8. Thesystem of claim 1, wherein the bagging station is configured to: createa vacuum within the die bag; and heat seal the die bag with the diebundle in a vacuum environment inside.
 9. The system of claim 1, whereinthe one or more die vessels are a predetermined number of die vessels.10. The system of claim 1, wherein the bundle station is furtherconfigured to move the harness over the stacked one or more die vesselsand then tightened the harness over the stacked one or more die vesselsto cause the die vessels to adhere together.
 11. The system of claim 1,wherein each die bag is folded at the folding station so that each diebag fits within one of the respective shelves of the outport car and areseparated vertically from each other.
 12. The system of claim 1, whereinif the inspection station detects a defect in the one or more dievessels, the inspection station is configured to move the one or moredie vessels with the defect to a remediation location for remediation.13. An integrated semiconductor die parceling platform comprising: aninspection station configured to receive a die vessel, wherein theinspection station is configured to inspect the die vessel for defectsutilizing an image sensor arranged over part of a conveyor system; adesiccant station configured to receive the die vessel from theinspection station, wherein the desiccant station comprises at least onedesiccant loader that is configured to add a desiccant to the dievessel; a bundle station configured to receive the die vessel from thedesiccant station, wherein the bundle station comprises a plurality ofdie vessels stacked on top of one another and configured to be securedtogether via a harness; a bagging station configured to receive the diebundle from the bundle station, wherein the bagging station isconfigured to dispose the die bundle in a die bag and to heat seal thedie bag with the die bundle inside, wherein the bagging stationcomprises a suction conduit configured to remove a gas from the die bag;and a folding station configured to receive the die bag from the baggingstation, wherein the folding station comprises a robotic arm configuredto fold the die bag and deposit the folded die bag onto one of aplurality of shelves of an outport car, wherein the outport cartransports the folded die bag from the integrated semiconductor dieparceling platform, wherein each station is a stationary point forprocessing the one or more die vessels.
 14. The integrated semiconductordie parceling platform of claim 13, wherein the die bundle is securedvia a harness, and wherein the bundle station is configured to move theharness over the stacked one or more die vessels and then tightened theharness over the stacked one or more die vessels to cause the stackedone or more die vessels to adhere together.
 15. The integratedsemiconductor die parceling platform of claim 13, wherein the inspectionstation, the desiccant station, the bundle station, and the baggingstation are connected via the conveyor system that moves the die vesselin an automated manner.
 16. The integrated semiconductor die parcelingplatform of claim 13, wherein the conveyor system comprises a conveyorbelt.
 17. The integrated semiconductor die parceling platform of claim13, wherein the bagging station is configured to print a bar code on thedie bag.
 18. The integrated semiconductor die parceling platform ofclaim 13, wherein if the inspection station detects a defect in the oneor more die vessels, the inspection station is configured to move theone or more die vessels with the defect to a remediation location forremediation.
 19. An outport car processing manipulator system of a dieparceling platform, the system comprising: a folding station configuredto receive one or more die bags from a bagging station via a conveyersystem, wherein the folding station comprises at least one robotic armconfigured to: fold each of the one or more die bags to reduce a size ofthe die bag in order that the die bag fits one of a number of respectiveshelves of an outport car; and place each of the one or more folded diebags onto the one of the number of the respective shelves of the outportcar, wherein the outport car transports the one or more folded die bagsfrom the die parceling platform.
 20. The outport car processingmanipulator system of claim 19, wherein each of the one or more die bagsare separated vertically from each other.